Specific Process Knowledge/Thin film deposition: Difference between revisions
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*[[/MVD|MVD]] - ''Molecular Vapor Deposition'' | *[[/MVD|MVD]] - ''Molecular Vapor Deposition'' | ||
* | *Electroplating of Ni, Cu, Au, etc. - ''Ask in the department of Mechanical Engineering'' | ||
*MOCVD - Epitaxial growth of InP, GaAs and other III-V materials - ''Ask DTU Electro if you are interested: [mailto:esem@dtu.dk Elizaveta Semenova] or [mailto:kryv@dtu.dk Kresten Yvind]'' | |||
*MOCVD - Epitaxial growth - ''Ask | |||
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Revision as of 11:28, 15 January 2024
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Choose material to deposit
Semiconductors | Oxides | Nitrides | Carbon and Carbides | Metals | Alloys | Transparent conductive oxides | Polymers | Multilayers |
Aluminium Oxide (Al2O3)
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Silicon Nitride - and oxynitride
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Carbon
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Aluminium
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AlCu And an electroceramic: YSZ (Yttrium stabilized zirconia) |
ITO (Tin doped Indium Oxide) |
SU-8 |
Oh no! My material is not on the list! Please contact the Thin Film group if you would like to inquire about a material that is not mentioned here.
Choose deposition equipment
PVD - Physical vapor deposition | LPCVD - low pressure chemical vapor deposition | PECVD - plasma enhanced chemical vapor deposition | ALD - atomic layer deposition | Coaters - for polymers | Others
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See the Lithography/Coaters page for coating polymers |
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