Specific Process Knowledge/Thermal Process: Difference between revisions

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*[[/Furnace: Multipurpose annealing |Furnace: Multipurpose annealing ]] - ''For annealing, oxidation and resist pyrolysis''
*[[/Furnace: Multipurpose annealing |Furnace: Multipurpose annealing ]] - ''For annealing, oxidation and resist pyrolysis''
*[[/RTP Jipelec 2|RTP2 Jipelec]] - ''For rapid thermal annealing of III-V materials, Si-based materials and some metals''
*[[/RTP Jipelec 2|RTP2 Jipelec]] - ''For rapid thermal annealing of III-V materials, Si-based materials and some metals''
*[[/RTP Annealsys|RTP Annealsys]] - ''For rapid thermal annealing and smoothing of Si based materials''
*[[/RTP Annealsys|RTP Annealsys]] - ''For rapid thermal annealing and smoothing of Si-based materials''
*[[/BCB Curing Oven|BCB Curing oven]] - ''For resist curing and metal alloying''layers''
*[[/BCB Curing Oven|BCB Curing oven]] - ''For resist curing and metal alloying''layers''



Revision as of 13:59, 8 January 2024

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A stack furnaces:

C stack furnaces:

E stack furnaces:

Other furnaces:

Rules for storage and RCA cleaning of wafers to the A and C stack furnaces


Manual for the furnace computer to the A, B, C and E stack furnaces

The A, B, C and E stack furnaces can be controlled either from a touch screen by each furnace or from a furnace computer. The user manual for the furnace computer can be found here in LabManager (login required):

Decommissioned equipment