Specific Process Knowledge/Thermal Process/RTP Jipelec 2: Difference between revisions
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*Chips on carrier | *Chips on carrier | ||
*100 mm or 150 mm wafers | *50 mm, 100 mm or 150 mm wafers | ||
|style="background:WhiteSmoke; color:black;" align="left"| '''Small samples''' must be '''placed''' on '''dedicated carrier wafers'''. These '''do not need to and should not be''' bonded to the carriers. | |style="background:WhiteSmoke; color:black;" align="left"| '''Small samples''' must be '''placed''' on '''dedicated carrier wafers/susceptors'''. These '''do not need to and should not be''' bonded to the carriers. | ||
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| style="background:Silver; color:black"|Allowed materials | | style="background:Silver; color:black"|Allowed materials | ||
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*Silicon | *Silicon | ||
*Silicon | *Silicon oxides and nitrides | ||
* | *Quartz | ||
*Metals - ask for permisson | |||
*III-V materials - '''these cannot be heated above 450 °C,''' otherwise it can lead to outgassing of toxic gases. For that reason, '''III-V samples are limited to a maximum process temperature of 440 °C.''' | |||
|style="background:WhiteSmoke; color:black;" align="left"| During previous testing, '''silicon nitride''' and '''aluminum oxide''' were only used as '''coating/masking materials''' and have been proven capable of sustaining this type of high temperature processing. | |style="background:WhiteSmoke; color:black;" align="left"| During previous testing, '''silicon nitride''' and '''aluminum oxide''' were only used as '''coating/masking materials''' and have been proven capable of sustaining this type of high temperature processing. | ||
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