Specific Process Knowledge/Back-end processing/Micro transfer printer: Difference between revisions

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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,298 edits
No edit summary
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!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|UV exposure  
UV exposure  
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Revision as of 09:50, 31 August 2023

The contents on this page, including all images and pictures, was created by DTU Nanolab staff unless otherwise stated.

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Equipment info in LabManager - requires login

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Equipment performance and process related parameters

Purpose UV exposure
Performance Exposure mode
  • Flood exposure
  • Proximity exposure with mask possible for 4inch substrate
  • Inclined exposure
  • Rotating exposure
Exposure light/filters
  • Near UV(350-450nm)
  • Mid UV (260-320nm)
  • Deep UV(220-260nm)
Minimum structure size
Mask size

5x5inch optinal

Alignment modes

No alignment possible

Substrates Substrate size

Up to 8inch substrates, different shapes

Allowed materials

All cleanroom materials

Batch

1


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