Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4: Difference between revisions
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*[[/Barc Etch|Barc Etch]] | *[[/Barc Etch|Barc Etch]] | ||
*[[/SiO2 Etch|SiO2 Etch]] | *[[/SiO2 Etch|SiO2 Etch]] | ||
*[[/Nitride Etch|Nitride etch with SiO2 etch recipes]] | |||
*[[/Slow etch|Slow etch of silicon nitride and silicon oxide]] | *[[/Slow etch|Slow etch of silicon nitride and silicon oxide]] | ||
Revision as of 10:28, 22 August 2023
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Pegasus 4 - 150mm silicon oxide and silicon nitride etching
The user manual and contact information can be found in LabManager:
DRIE Pegasus 4 in LabManager - requires login
Process information
Standard recipes
- Barc Etch
- SiO2 Etch
- Nitride etch with SiO2 etch recipes
- Slow etch of silicon nitride and silicon oxide
Wafer bonding
To find information on how to bond wafers or chips to a carrier wafer, click here.