Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4: Difference between revisions

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==Pegasus 4 - 150mm silicon oxide and silicon nitride etching==
==Pegasus 4 - 150mm silicon oxide and silicon nitride etching==


'''The tool is already installed and ready to process. You still have to make manual alignment in the cassette.
'''


  [[Image:Peg3and4 front 2.JPG |frame|left|x300px|The DRIE-Pegasus3 and DRIE-Pegasus4 operator station and cassette loading stations, {{photo1}}]]
  [[Image:Peg3and4 front 2.JPG |frame|left|x300px|The DRIE-Pegasus3 and DRIE-Pegasus4 operator station and cassette loading stations, {{photo1}}]]

Revision as of 08:29, 22 August 2023

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Pegasus 4 - 150mm silicon oxide and silicon nitride etching

The DRIE-Pegasus3 and DRIE-Pegasus4 operator station and cassette loading stations, Photo: DTU Nanolab internal


The user manual(s), quality control procedure(s) and results, user APV(s) are not available, technical information and contact information can be found in LabManager:

Equipment info in LabManager

Process information

Standard recipes

Hardware changes

A few hardware modifications have been made on the Pegasus 3/4 since it was installed in 2019. The changes are listed below.


Wafer bonding

To find information on how to bond wafers or chips to a carrier wafer, click here.

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