Specific Process Knowledge/Characterization: Difference between revisions
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| width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Drop_Shape_Analyzer|Drop shape analyser]]''' | | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Drop_Shape_Analyzer|Drop shape analyser]]''' | ||
| width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Hardness_measurement|Hardness tester]]''' | | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Hardness_measurement|Hardness tester]]''' | ||
| width="50" align="center" style="background:#f0f0f0;"|'''[[ | | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific Process Knowledge/Characterization/Particle Scanner Takano|Particle scanner]]''' | ||
| width="50" align="center" style="background:#f0f0f0;"|'''IR-camera''' | | width="50" align="center" style="background:#f0f0f0;"|'''IR-camera''' | ||
| width="50" align="center" style="background:#f0f0f0;"|'''[[Specific Process Knowledge/Characterization/III-V_ECV-profiler|III-V ECV-profiler]]''' | | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific Process Knowledge/Characterization/III-V_ECV-profiler|III-V ECV-profiler]]''' |
Revision as of 13:59, 13 June 2023
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Overview of characteristics and where to measure it
Optical Micro- scopes | SEM (incl. EDX) | AFM | Stylus profiler | Optical profiler | Filmtek (reflec- tometer) | Ellip- someter | Thickness stylus | XPS | PL mapper | 4-point probe | Probe station | XRD | Life time scanner | Drop shape analyser | Hardness tester | Particle scanner | IR-camera | III-V ECV-profiler | |
Breakdown voltage | |||||||||||||||||||
Carrier density/doping profile | x | ||||||||||||||||||
Charge carrier life time | x | ||||||||||||||||||
Contact angle hydrophobic/hydrophillic | x | ||||||||||||||||||
Crystallinity | x | ||||||||||||||||||
Deposition uniformity | x | x | x | ||||||||||||||||
Dimensions(in plane) | x | x | (x) | (x) | x | ||||||||||||||
Dimensions(height)/Topography | (x) | (x) | x | x | x | ||||||||||||||
Electrical conductivity | x | ||||||||||||||||||
Element analysis | x | x | x 4) | x 4) | |||||||||||||||
Film stress | x | x | |||||||||||||||||
Imaging | x | x | x | x | |||||||||||||||
Material Hardness | x | ||||||||||||||||||
Band gap | x | x | x | ||||||||||||||||
Particles | x | x | x | x | |||||||||||||||
Phase changes | |||||||||||||||||||
Reflectivity | x | x | x 6) | ||||||||||||||||
Refractive index | x | x | |||||||||||||||||
Resistivity | x | ||||||||||||||||||
Step coverage | x 1) | x 1) | |||||||||||||||||
Surface roughness | x | x | x | x | |||||||||||||||
Thermal conductivity | |||||||||||||||||||
Thin film thickness | x 1) | x 1) | x 2) | x 2) | x | x | x | x 5) | x 3) | x | |||||||||
Voids in wafer bonding | x | x | x | ||||||||||||||||
Wafer thickness | x 1) | x 1) | x | ||||||||||||||||
Work function | x |
- Using the cross section method
- Using the create step method
- With known resistivity
- Composition information for crystalline materials
- Only single layer
- Good for characterization of VCSEL structures and DBR mirrors
Choose characterization topic
- Element analysis
- Measurement of film thickness and optical constants
- Photoluminescence mapping
- Sample imaging
- Sample preparation for inspection
- Stress measurement
- Hardness measurement
- Wafer thickness measurement
- Topographic measurement
- Contact angle measurement
- Four-Point Probe (Resistivity measurement)
- Carrier density (doping) profiler
- Scanning Electron Microscopy
- X-ray diffraction
Choose equipment
AFM
Electrical measurements
- 4-Point Probe
- Probe station
- III-V ECV-profiler (Electrochemical Capacitance-Voltage carrier density profiler)
Element analysis
Optical and stylus profilers
- Optical Profiler (Sensofar)
- Dektak XTA stylus profiler
- P17 stylus profiler from KLA-Tencor
- Dektak 3ST stylus profiler
- Stylus Profiler:Dektak150
Optical microscopes
Optical characterization
SEMs at DTU Nanolab - building 307/314
SEM's in building 346
TEMs at DTU Nanolab - building 307/314
XRD
- XRD Powder, tabletop XRD for Bregg-Brentano measurements of powders
- XRD SmartLab, advanced multipurpose instrument in the cleanroom