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Specific Process Knowledge/Etch/KOH Etch: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Kabi (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
1,146 edits
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|style="background:LightGrey; color:black"|Etch rates in PECVD SiN  
|style="background:LightGrey; color:black"|Etch rates in PECVD SiN  
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|style="background:WhiteSmoke; color:black"|See etchrates for PECVD SiN [[https://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Silicon_Nitride/Deposition_of_Silicon_Nitride_using_PECVD/PECVD3:_Low_stress_nitride_testing&section=2 here]]  
|style="background:WhiteSmoke; color:black"|See etchrates for PECVD SiN [[https://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Silicon_Nitride/Deposition_of_Silicon_Nitride_using_PECVD/PECVD3:_Low_stress_nitride_testing here]]  
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