Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions

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 Pegasus 2 stands out as it is a dedicated research tool where much fewer processes are allowed. As such, the instrument will not be released for general use for a wide range of applications.
-Whereas Pegasus 1 and 3 are intended to serve as stable platforms with limited or no changes in hardware, Pegasus 2 has been subject to experiments. For instance, as of the end of 2020 the instrument has been set up to run [http://labadviser.nanolab.dtu.dk/images/d/d6/CORE1.pdf '''the CORE process''']. This means that comparing to [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-1|DRIE-Pegasus 1]] and
+Whereas Pegasus 1 and 3 are intended to serve as stable platforms with limited or no changes in hardware, Pegasus 2 has been subject to experiments. For instance, as of the end of 2020 the instrument has been set up to run
+[[#anchor_CORE1]]
+[http://labadviser.nanolab.dtu.dk/images/d/d6/CORE1.pdf '''the CORE process''']. This means that comparing to [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-1|DRIE-Pegasus 1]] and
 [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-3|DRIE-Pegasus 3]], Pegasus 2 and its allowed usage have been modified (this list is not complete - see the complete list in the table below). For instance:
 # The C<sub>4</sub>F<sub>8</sub> MFC has been disconnected to maintain a carbon-free (carbon containing masks are allowed) chamber.