Specific Process Knowledge/Lithography/4562: Difference between revisions

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	After exposure, the nitrogen generated in the resist film must be allowed to diffuse out, in order to avoid bubble formation (in particular before any heating). This process is similar to rehydration, but usually slower.		After exposure, the nitrogen generated in the resist film must be allowed to diffuse out, in order to avoid bubble formation (in particular before any heating). This process is similar to rehydration, but usually slower.


	'''Exposure in mask aligner:'''<br>		'''Exposure in mask aligner:'''<br>