Jump to content

Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 03 processing: Difference between revisions

← Older editNewer edit →
VisualWikitext
Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,931 edits
Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,931 edits
Line 153: Line 153:
-16000 | -46000 | um | 2000 | um | TARAN DTU Nanolab 20190320
-16000 | -46000 | um | 2000 | um | TARAN DTU Nanolab 20190320


This produces a 2mm high, approximately 32mm long wafer ID at the flat of a 4" wafer. Some special characters are not allowed (e.g. ';').
This produces a 2 mm high, approximately 32 mm long wafer ID at the flat of a 100 mm wafer. Some special characters are not allowed (eg. ';').


<br clear="all" />
<br clear="all" />
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing"