Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions
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==HMDS== | ==HMDS== | ||
In the HMDS priming process, the -OH groups on the surface of the substrate are replaced with Si(CH<sub>3</sub>)<sub>3</sub>, thus changing the surface from hydrophilic to (more) hydrophobic. Substrates with surfaces of silicon or | In the HMDS priming process, the -OH groups on the surface of the substrate are replaced with Si(CH<sub>3</sub>)<sub>3</sub>, thus changing the surface from hydrophilic to (more) hydrophobic. Substrates with surfaces of silicon, or its oxides/nitrides, all work very well with HMDS pretreatment. | ||
Other semiconductors, insulators, or metals that form -OH groups on the surface may be suitable as well. The shelf life of substrates primed using HMDS (vapor phase) is long, maybe even several weeks. | |||
==Dip/spin-on adhesion promoter== | ==Dip/spin-on adhesion promoter== | ||