Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4: Difference between revisions
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*[[/Barc Etch|Barc Etch]] | *[[/Barc Etch|Barc Etch]] | ||
*[[/SiO2 Etch|SiO2 Etch]] | *[[/SiO2 Etch|SiO2 Etch]] | ||
*[[/Slow etch|Slow etch of silicon nitride and silicon oxide]] | *[[/Slow etch|Slow etch of silicon nitride and silicon oxide]] | ||
Revision as of 11:25, 3 February 2023
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Pegasus 4 - 150mm silicon oxide and silicon nitride etching
The tool is already installed and ready to process. You still have to make manual alignment in the cassette.
The user manual(s), quality control procedure(s) and results, user APV(s) are not available, technical information and contact information can be found in LabManager:
Equipment info in LabManager
Process information
Standard recipes
Hardware changes
A few hardware modifications have been made on the Pegasus 3/4 since it was installed in 2019. The changes are listed below.
Wafer bonding
To find information on how to bond wafers or chips to a carrier wafer, click here.