Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions
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BHF is mostly used to do pretreatment for new Si wafers.<br> | BHF is mostly used to do pretreatment for new Si wafers.<br> | ||
The native oxide layer will be removed by 30 seconds of etching and this will promote the resist adhesion on the Si substrates. We recommend to spin coat resist as soon as possible after the procedure. | The native oxide layer will be removed by 30 seconds of etching and this will promote the resist adhesion on the Si substrates. We recommend to spin coat resist as soon as possible after the procedure. | ||
'''The user manual, user APV, and contact information can be found in LabManager:''' | '''The user manual, user APV, and contact information can be found in LabManager:''' | ||