Specific Process Knowledge/Lithography/Resist/UVresist: Difference between revisions
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All doses are for standard silicon wafers, unless otherwise stated. Development is done using 2.38% TMAH. | All doses are for standard silicon wafers, unless otherwise stated. Development is done using 2.38% TMAH. | ||
===KS Aligner=== | ===KS Aligner=== | ||
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For smaller angle (~5°), develop 30 seconds instead | For smaller angle (~5°), develop 30 seconds instead | ||
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===Aligner: MA6 - 2=== | ===Aligner: MA6 - 2=== | ||