Specific Process Knowledge/Lithography/LiftOff: Difference between revisions
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The image to the left shows a schematic of the lift off process. | The image to the left shows a schematic of the lift off process. | ||
#The substrate is coated with the masking material | #The substrate is coated with the masking material | ||
#The masking material is patterned. The mask must be a negative image of the desired material pattern | #The masking material is patterned. The mask must be a negative image of the desired material pattern | ||
#The material is deposited on top of both mask and substrate. The mask sidewall slope should be negative in order to prevent the material covering the sidewalls during deposition | #The material is deposited on top of both mask and substrate. The mask sidewall slope should be negative in order to prevent the material covering the sidewalls during deposition | ||
#The masking material is dissolved, thus lifting part of the deposited material | #The masking material is dissolved, thus lifting part of the deposited material | ||
#The remaining material forms the desired pattern on the substrate | #The remaining material forms the desired pattern on the substrate | ||