Specific Process Knowledge/Lithography/Development/DUV developer: Difference between revisions
Created page with "=Developer: TMAH Stepper = 300x300px|right|thumb|The Developer-TMAH-Stepper is placed in F-3 This developer is dedicated for development of DUV resists. The developer is fully automatic and can run up to 25 substrates in a batch 4", 6", and 8" size (8" requires tool change). The machine is equipped with 1 developer line, in our case 2,38% TMAH in water (AZ 726 MIF), 1 topside rinse line with water, 1 backside rinse line with water and 1 N2 line f..." |
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Here you can find a [[media:250nm_ines_and_pillars_after_developing_i_60sec.pdf| chart]] demonstrating a dependence between 250 nm line width/pillars diameter and exposure dose. | Here you can find a [[media:250nm_ines_and_pillars_after_developing_i_60sec.pdf| chart]] demonstrating a dependence between 250 nm line width/pillars diameter and exposure dose. | ||
==Standard processes== | |||
Post-exposure bake sequences: | Post-exposure bake sequences: | ||
