Specific Process Knowledge/Lithography/DUVStepperLithography: Difference between revisions
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=Developer: TMAH Stepper = | =Developer: TMAH Stepper = | ||
[[Image:SUSS_DEV.JPG|300x300px|right|thumb|The Developer-TMAH-Stepper is placed in F-3]] | [[Image:SUSS_DEV.JPG|300x300px|right|thumb|The Developer-TMAH-Stepper is placed in F-3]] | ||
This developer is dedicated for development of DUV resists. The developer is fully automatic and can run up to 25 substrates in a batch 4", 6", and 8" size (8" requires tool change). The machine is equipped with 1 developer line, in our case 2,38% TMAH in water (AZ 726 MIF), 1 topside rinse line with water, 1 backside rinse line with water and 1 N2 line for drying. | This developer is dedicated for development of DUV resists. The developer is fully automatic and can run up to 25 substrates in a batch 4", 6", and 8" size (8" requires tool change). The machine is equipped with 1 developer line, in our case 2,38% TMAH in water (AZ 726 MIF), 1 topside rinse line with water, 1 backside rinse line with water and 1 N2 line for drying. | ||
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