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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,893 edits
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==Aligner: Maskless 03==
==Aligner: Maskless 03==
'''Feedback to this section''': '''[mailto:lithography@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_03 click here]'''
MLA150 WMII maskless aligner from Heidelberg Instruments GmbH.
MLA150 WMII maskless aligner from Heidelberg Instruments GmbH.


The logon password for the PC is "mla" (without quotation marks).
The logon password for the PC is "mla" (without quotation marks).


Special features:
 
'''Special features:'''
*Backside Alignment
*Backside Alignment
*Advanced Field Alignment Mode for alignment to individual chips/devices on the substrate
*Advanced Field Alignment Mode for alignment to individual chips/devices on the substrate
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Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=464 LabManager]
Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=464 LabManager]
===Exposure dose and defocus===
[[Specific Process Knowledge/Lithography/Resist#Aligner:_Maskless_02|Information on UV exposure dose]]


===[[Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 03 processing|Process information]]===
===[[Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 03 processing|Process information]]===
 
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing#Exposure_technology|Exposure technology]]
[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing#Exposure_technology|Exposure technology]]
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing#Process_Parameters|Process Parameters]]
 
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing#Features|Features]]
[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing#Process_Parameters|Process Parameters]]
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing#Alignment|Alignment]]
 
[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing#Features|Features]]
 
[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing#Alignment|Alignment]]


=== Equipment performance and process related parameters ===
=== Equipment performance and process related parameters ===
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