Specific Process Knowledge/Lithography/Coaters/RCD8: Difference between revisions

Revision as of 15:06, 27 January 2023

Spin Coater: RCD8

Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist.

However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes.

The user manual, user APV, and contact information can be found in LabManager

Process information

Equipment performance and process related parameters

Purpose		Spin coating of SU-8 resists Spin coating of PGMEA based AZ resists Spin coating of wafers with structured backside Edge bead removal
Resist		manual dispense automatic dispense from syringe
Performance	Coating thickness	SU-8 resits: 0.1-200+ µm AZ 5214E: 1.5-3 µm AZ 4562: 8-15 µm AZ MiR 701: 1.5-3 µm AZ nLOF 2020: 2-3.5 µm
Process parameters	Spin speed	Vacuum chuck: 10 - 5000 rpm Non-vacuum chuck: Max. 3000 rpm
Process parameters	Spin acceleration	10 - 3000 rpm/s Max. 1500 rpm/s with Gyrset
Substrates	Substrate size	100 mm wafers 150 mm wafers (vacuum chuck only)
	Allowed materials	All cleanroom materials ?
	Batch	1

@@ Line 20: / Line 20: @@
 !style="background:silver; color:black;" align="center" width="60"|Purpose
 |style="background:LightGrey; color:black"|
-|style="background:WhiteSmoke; color:black" align="center"|
+|style="background:WhiteSmoke; color:black"|
 *Spin coating of SU-8 resists
 *Spin coating of PGMEA based AZ resists
@@ Line 28: / Line 28: @@
 !style="background:silver; color:black;" align="center" width="60"|Resist
 |style="background:LightGrey; color:black"|
-|style="background:WhiteSmoke; color:black" align="center"|
+|style="background:WhiteSmoke; color:black"|
 * manual dispense
 * automatic dispense from syringe
@@ Line 34: / Line 34: @@
 !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
 |style="background:LightGrey; color:black"|Coating thickness
-|style="background:WhiteSmoke; color:black" align="center"|
+|style="background:WhiteSmoke; color:black"|
 * SU-8 resits: 0.1-200+ µm
 * AZ 5214E: 1.5-3 µm
@@ Line 43: / Line 43: @@
 !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
 |style="background:LightGrey; color:black"|Spin speed
-|style="background:WhiteSmoke; color:black" align="center"|
+|style="background:WhiteSmoke; color:black"|
 Vacuum chuck: 10 - 5000 rpm <br>
 Non-vacuum chuck: Max. 3000 rpm
 |-
 |style="background:LightGrey; color:black"|Spin acceleration
-|style="background:WhiteSmoke; color:black" align="center"|
+|style="background:WhiteSmoke; color:black"|
 - 3000 rpm/s <br>
 Max. 1500 rpm/s with Gyrset
@@ Line 54: / Line 54: @@
 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
 |style="background:LightGrey; color:black"|Substrate size
-|style="background:WhiteSmoke; color:black" align="center"|
+|style="background:WhiteSmoke; color:black"|
 * 100 mm wafers
 * 150 mm wafers (vacuum chuck only)
 |-
 | style="background:LightGrey; color:black"|Allowed materials
-|style="background:WhiteSmoke; color:black" align="center"|
+|style="background:WhiteSmoke; color:black"|
 All cleanroom materials ?
 |-
 |style="background:LightGrey; color:black"|Batch
-|style="background:WhiteSmoke; color:black" align="center"|
+|style="background:WhiteSmoke; color:black"|
 |-