Specific Process Knowledge/Lithography/Coaters/RCD8: Difference between revisions

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Created page with "==Spin Coater: RCD8== 400px|thumb|Spin coater: RCD8 is located in C-1 Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist. However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes. '''The user manual, user APV, and c..."
 
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[[Image:Spinner_RCD8_C-1.jpg|400px|thumb|Spin coater: RCD8 is located in C-1]]
[[Image:Spinner_RCD8_C-1.jpg|400px|thumb|Spin coater: RCD8 is located in C-1]]


Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist. However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes.
Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist.  
 
However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes.


'''The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=360 LabManager]'''
'''The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=360 LabManager]'''


===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing|Process information]]===
===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing|Process information]]===
 
*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Spin coating|Spin coating]]
[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Spin coating|Spin coating]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Automatic dispense|Automatic dispense]]
 
*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Recipes|Recipes and templates]]
[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Automatic dispense|Automatic dispense]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Processing_results|Processing results]]
 
[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Recipes|Recipes and templates]]
 
[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Processing_results|Processing results]]


=== Equipment performance and process related parameters ===
=== Equipment performance and process related parameters ===

Revision as of 15:05, 27 January 2023

Spin Coater: RCD8

Spin coater: RCD8 is located in C-1

Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist.

However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes.

The user manual, user APV, and contact information can be found in LabManager

Process information

Equipment performance and process related parameters

Purpose
  • Spin coating of SU-8 resists
  • Spin coating of PGMEA based AZ resists
  • Spin coating of wafers with structured backside
  • Edge bead removal
Resist
  • manual dispense
  • automatic dispense from syringe
Performance Coating thickness
  • SU-8 resits: 0.1-200+ µm
  • AZ 5214E: 1.5-3 µm
  • AZ 4562: 8-15 µm
  • AZ MiR 701: 1.5-3 µm
  • AZ nLOF 2020: 2-3.5 µm
Process parameters Spin speed

Vacuum chuck: 10 - 5000 rpm
Non-vacuum chuck: Max. 3000 rpm

Spin acceleration

10 - 3000 rpm/s
Max. 1500 rpm/s with Gyrset

Substrates Substrate size
  • 100 mm wafers
  • 150 mm wafers (vacuum chuck only)
Allowed materials

All cleanroom materials ?

Batch

1