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Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions

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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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BHF is mostly used to do pretreatment for new Si wafers.<br>
BHF is mostly used to do pretreatment for new Si wafers.<br>
The native oxide layer will be removed during 30 sec etching and this will promote the resist adhesion on the Si substrates. We recommend to spin coat resist as soon as possible after the procedure.
The native oxide layer will be removed by 30 seconds of etching and this will promote the resist adhesion on the Si substrates. We recommend to spin coat resist as soon as possible after the procedure.


'''The user manual, user APV, and contact information can be found in LabManager:'''
'''The user manual, user APV, and contact information can be found in LabManager:'''
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===Process information===
===Process information===
For more information on this BHF bath take a look here:
More information on BHF:
[[Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF)|Wet Silicon Oxide Etch (BHF)]]
[[Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF)|Wet Silicon Oxide Etch (BHF)]]


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