Jump to content

Specific Process Knowledge/Characterization/XRD/XRD SmartLab: Difference between revisions

← Older editNewer edit →
VisualWikitext
Eves (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,346 edits
Eves (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,346 edits
Line 34: Line 34:


* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Aluminium/Al_Ebeam_evaporation_in_Temescal|e-beam deposited Al thin films]].
* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Aluminium/Al_Ebeam_evaporation_in_Temescal|e-beam deposited Al thin films]].
* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Aluminium/Al_Sputtering_in_Cluster_Lesker_PC3#X-ray_reflectivity_analysis|DC sputtered Al thin films]].


* Characterization of [[Specific_Process_Knowledge/Characterization/XRD/XRD_SmartLab/ALD_deposited_alumina_and_titania_XRR|ALD deposited Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> ultrathin layers]].
* Characterization of [[Specific_Process_Knowledge/Characterization/XRD/XRD_SmartLab/ALD_deposited_alumina_and_titania_XRR|ALD deposited Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> ultrathin layers]].
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Characterization/XRD/XRD_SmartLab"