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| {| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2" align="left" width="430px" | | {| class="wikitable hideable hidden" |
| !colspan="3" style="text-align:left;" | [[image:Thermal treat your sample.png|x100px|Thermal treatment of your sample]] Thermal treatment of your sample
| | {{Template:Peg2cont1 |
| |- | | |stepname= 0 Home matching |
| !Entry page in LabAdviser
| | |generalbox= |
| !Techniques
| | |timebox=90t |
| !Materials
| | |presbox=7T |
| |- | | |gasbox=sulf |
| |rowspan="5" valign="top"|[[Specific Process Knowledge/Thermal Process|Thermal Process]] | | |RFbox= yes, lots |
| |Annealing (>350C) | | |matchbox= lit |
| |Si, PECVD layers, Al, BCB curing, Polymer | | |miscbox=na |
| |- | | }} |
| |Oxidation
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| |Si wafers
| |
| |-
| |
| |Doping with B/P
| |
| |Si wafers
| |
| |-
| |
| |Pyrolysis
| |
| |Resists: AZ, SU8, PDMS
| |
| |- | |
| |Rapid Thermal Anneal (RTP) | |
| |SiO2, Si3N4, Ti, III-V
| |
| |-
| |
| |
| |
| [[Specific Process Knowledge/Lithography/Baking| Lithography/Baking]] <br>
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| |Baking (<300dg)
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| |baking resist and polymers
| |
| |-
| |
| |} | | |} |
| {| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2" align="left" width="430px" | | {| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2" align="left" width="430px" |
