Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4: Difference between revisions
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*[[/SiO2 Etch|SiO2 Etch]] | *[[/SiO2 Etch|SiO2 Etch]] | ||
*[[/SiN Etch|Silicon Nitride Etch]] | *[[/SiN Etch|Silicon Nitride Etch]] | ||
*[[/Slow etch|Slow etch of silicon nitride and silicon oxide]] | |||
'''Hardware changes''' | '''Hardware changes''' | ||
Revision as of 14:25, 6 December 2022
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Pegasus 4 - 150mm silicon oxide and silicon nitride etching
The tool is already installed and ready to process. You still have to make manual alignment in the cassette.
The user manual(s), quality control procedure(s) and results, user APV(s) are not available, technical information and contact information can be found in LabManager:
Equipment info in LabManager
Process information
Standard recipes
Hardware changes
A few hardware modifications have been made on the Pegasus 3/4 since it was installed in 2019. The changes are listed below.
Wafer bonding
To find information on how to bond wafers or chips to a carrier wafer, click here.
Internal Nanolab Process log for Pegasus 4
Process log at Nanolab [1]