Specific Process Knowledge/Thermal Process/Dope with Phosphorus: Difference between revisions
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==Phosphorous doping test after change of hardware== | |||
In 2022, the POCl has line lines on the furnace were modified. At the same time some software changed were also made, and the recipes on the furncewere updated. | |||
Afterwards, a phosphorus doping test was made with a test wafer and four dummy wafers (two dummy wafers on each side of the test wafers) in the furnace. | |||
====Process:==== | |||
* RCA cleaning of test wafer (p-type, 1-20 Ωcm) and dummy wafers | |||
* Phosphorus pre-dep in the A4 furnace. Recipe: "POCLNEW", 900 °C, 15 min phosphorus pre-dep and 20 min annealing | |||
* BHF dip in the RCA cleaning bench to remove phosphorus glass from the test wafer | |||
* Measure sheet resistance using the 4-point proble | |||
====Results:==== | |||
After the process describe above, the sheet resistance on the test wafer was measured. | |||
The sheet resistance was 54 Ωsq in the center of the wafer and 45-48 Ωsq in the edge of the wafer. This correspond quite quite good to results that have been obtained previously for the furnace as can be seen on this LabAdviser page. | |||