Specific Process Knowledge/Thin film deposition/Deposition of Silicon: Difference between revisions
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* [[Specific Process Knowledge/Thin film deposition/Deposition of Silicon/Si sputter in Sputter-System Lesker|Si sputter deposition in the Sputter-System (Lesker)]] - ''includes information on surface roughness and stress'' | * [[Specific Process Knowledge/Thin film deposition/Deposition of Silicon/Si sputter in Sputter-System Lesker|Si sputter deposition in the Sputter-System (Lesker)]] - ''includes information on surface roughness and stress'' | ||
* [[Specific Process Knowledge/Thin film deposition/Deposition of Silicon/Si sputter in Sputter-System Metal-Oxide(PC1)|Si sputter deposition in the Sputter-System Metal-Oxide(PC1)]] | * [[Specific Process Knowledge/Thin film deposition/Deposition of Silicon/Si sputter in Sputter-System Metal-Oxide(PC1)|Si sputter deposition in the Sputter-System Metal-Oxide(PC1)]] | ||
* [[Specific Process Knowledge/Thin film deposition/Deposition of Silicon/Si sputter in Sputter-System Metal-Oxide(PC3)|Si sputter deposition in the Sputter-System Metal-Oxide(PC3)]] | |||
==Deposition of Silicon using PECVD== | ==Deposition of Silicon using PECVD== | ||