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Specific Process Knowledge/Thermal Process/E1 Furnace Oxidation (8"): Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Paphol (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
912 edits
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!style="background:silver; color:black;" align="center"|Purpose  
!style="background:silver; color:black;" align="center"|Purpose  
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
*Oxidation of 100 mm and 150 mm wafers
*Oxidation of 150 mm and 200 mm wafers
*Annealing of 100 mm and 150 mm wafers
*Annealing of 150 mm and 200 mm wafers
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
Annealing:
Annealing:
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Oxidation:
Oxidation:
*Dry oxidation using O<sub>2</sub>  
*Dry oxidation using O<sub>2</sub>  
*Wet oxidation using H<sub>2</sub>O vapour generated by a RASIRC steamer
*Wet oxidation using H<sub>2</sub>O DI Water steam injection system ( Bronkhorst)
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!style="background:silver; color:black" align="center"|Performance
!style="background:silver; color:black" align="center"|Performance
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