Specific Process Knowledge/Thermal Process: Difference between revisions
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*[[/C3 Anneal-bond furnace|Anneal-bond furnace (C3)]] - ''For oxidation and annealing of bonded wafers'' | *[[/C3 Anneal-bond furnace|Anneal-bond furnace (C3)]] - ''For oxidation and annealing of bonded wafers'' | ||
*[[/C4 Aluminium Anneal furnace|Aluminium Anneal furnace (C4)]] - ''For annealing of wafers containing aluminium, Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> '' | *[[/C4 Aluminium Anneal furnace|Aluminium Anneal furnace (C4)]] - ''For annealing of wafers containing aluminium, Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> '' | ||
'''E stack furnaces:''' | |||
*[[/E1 Furnace Oxidation (8")|Oxidation (8") furnace (E1)]] - ''For oxidation and annealing of 150 mm and 200 mm wafers'' | |||
'''Other furnaces:''' | '''Other furnaces:''' | ||