Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions
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Sputtering: Depends on process parameters. See [[Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Sputtering of Cr in Wordentec|here]] and process log. | Sputtering: Depends on process parameters. See [[Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Sputtering of Cr in Wordentec|here]] and process log. | ||
|1 Å/s | |1 Å/s | ||
|Depends on process parameters. At least up to | |Depends on [[/Sputtering of Cr in Sputter System (Lesker)|process parameters]]. At least up to 1.48 Å/s. See process log. | ||
|Depends on process parameters. | |Depends on process parameters. | ||
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