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Specific Process Knowledge/Thermal Process/Jipelec RTP: Difference between revisions

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|style="background:LightGrey; color:black"|Process Temperature
|style="background:LightGrey; color:black"|Process Temperature
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*0-1100 <sup>o</sup>C
*0-1100 <sup>o</sup>C (only short time a the high temperatures - see the user manual)
*III-V materials only to 450 <sup>o</sup>C
*III-V materials only to 450 <sup>o</sup>C
*Temperature ramp up to 300 <sup>o</sup>C/min
*Temperature ramp up to 50 <sup>o</sup>C/min


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*One 50 mm or 100 mm wafer  
*One 50 mm or 100 mm wafer  
*Small samples (placed on a carbide carrier or a Si carrier wafer with 1 µm oxide)
*Small samples (placed on a carbide carrier or a Si carrier wafer with 1 µm oxide on the back)
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| style="background:LightGrey; color:black"|Substrate materials allowed
| style="background:LightGrey; color:black"|Substrate materials allowed
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A carrier is always needed: For III-V materials a carbide carrier is used, and for other samples a silicon carrier wafer with 1 µm oxide is used
A carrier is always needed: For III-V materials and metals a carbide carrier is used, and for other samples a silicon carrier wafer with 1 µm oxide is used
*Silicon  
*Silicon  
*Silicon oxide
*Silicon oxide
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*Polysilicon
*Polysilicon
*III-V materials (on graphite carrier, max 450 <sup>o</sup>C)
*III-V materials (on graphite carrier, max 450 <sup>o</sup>C)
*Some metals - Ask the Thin Film group for permission
*Some metals - (on graphite carrier). Ask the Thin Film group for permission
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