Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4

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Pegasus 4 - 150mm silicon oxide and silicon nitride etching

The tool is already installed and ready to process. You still have to make manual alignment in the cassette.

The twin Pegasi (3 and 4) have just been rolled into the lab on July 3rd 2018.

The user manual(s), quality control procedure(s) and results, user APV(s) are not available, technical information and contact information can be found in LabManager:

Equipment info in LabManager

Process information

Standard recipes

• Barc Etch
• SiO2 Etch

Hardware changes

A few hardware modifications have been made on the Pegasus 3/4 since it was installed in 2019. The changes are listed below.

• Change of showerhead in 2019

• Addition of Picoscope oscilloscope system for process monitoring in February 2019

Wafer bonding

To find information on how to bond wafers or chips to a carrier wafer, click here.

Internal Nanolab Process log for Pegasus 4

Process log at Nanolab [1]