Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
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[[Category: Etch (Dry) Equipment|DRIE]] | [[Category: Etch (Dry) Equipment|DRIE]] | ||
== | = DRIE-Pegasus 2= | ||
[[Image:Pegasus 2 operator.jpg |frame|x400px|The DRIE-Pegasus 2 operator station and load lock in the DTU Nanolab cleanroom A-1]] | |||
'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:''' | |||
Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=398| LabManager] | |||
==Restricted usage on a dedicated research tool == | |||
In general, the dry etch tools at DTU Nanolab are free to use for users with proper training. The users have freedom to etch the approved materials and substrates within rules specified in manuals, LabAdviser and cross contamination sheets. At the same time, the instruments are set up to meet the broadest range of etch demands in this way ensuring that most dry etch applications can be covered. For most of the instruments, however, there is a continuous tug of war between providing flexibility (for instance allowing mask materials that do not form any volatile etch products with the gas chemistry available in the process chamber) while ensuring process chamber cleanliness. | In general, the dry etch tools at DTU Nanolab are free to use for users with proper training. The users have freedom to etch the approved materials and substrates within rules specified in manuals, LabAdviser and cross contamination sheets. At the same time, the instruments are set up to meet the broadest range of etch demands in this way ensuring that most dry etch applications can be covered. For most of the instruments, however, there is a continuous tug of war between providing flexibility (for instance allowing mask materials that do not form any volatile etch products with the gas chemistry available in the process chamber) while ensuring process chamber cleanliness. | ||