Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
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'''Feedback to this page: | '''Feedback to this page: | ||
[mailto:labadviser@ | [mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus click here]''' | ||
[[Category: Equipment |Etch DRIE]] | [[Category: Equipment |Etch DRIE]] | ||
[[Category: Etch (Dry) Equipment|DRIE]] | [[Category: Etch (Dry) Equipment|DRIE]] | ||
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In general, the dry etch tools at DTU Nanolab are free to use for users with proper training. The users have freedom to etch the approved materials and substrates within rules specified in manuals, LabAdviser and cross contamination sheets. At the same time, the instruments are set up to meet the broadest range of etch demands in this way ensuring that most dry etch applications can be covered. For most of the instruments, however, there is a continuous tug of war between providing flexibility (for instance allowing mask materials that do not form any volatile etch products with the gas chemistry available in the process chamber) while ensuring process chamber cleanliness. | In general, the dry etch tools at DTU Nanolab are free to use for users with proper training. The users have freedom to etch the approved materials and substrates within rules specified in manuals, LabAdviser and cross contamination sheets. At the same time, the instruments are set up to meet the broadest range of etch demands in this way ensuring that most dry etch applications can be covered. For most of the instruments, however, there is a continuous tug of war between providing flexibility (for instance allowing mask materials that do not form any volatile etch products with the gas chemistry available in the process chamber) while ensuring process chamber cleanliness. | ||
Pegasus 2 is a dedicated research tool where the research group of professor Henri Jansen[ | Pegasus 2 is a dedicated research tool where the research group of professor Henri Jansen [mailto:henrija@dtu.dk] has freedom to explore the conventions of dry etching. This requires that a very strict control be applied to the process chamber in terms of the range of processes and substrates used. As such, it will not be released for general use for a wide range of applications. | ||
If you want to get access to the tool, then talk to professor Henry Jansen | If you want to get access to the tool, then talk to professor Henry Jansen | ||