Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
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|ItemComment=None of the recipes use coil power in order to prevent aluminium fluoride formation at the aluminium oxide dome. These particles may drop on the wafer or chuck and cause abnormalitites. | |ItemComment=None of the recipes use coil power in order to prevent aluminium fluoride formation at the aluminium oxide dome. These particles may drop on the wafer or chuck and cause abnormalitites. | ||
Most of the recipes | Most of the recipes rely on very low pressure and low power - 0.2 mTorr and 10 Watt platen power is not an error and easily supports the plasma. | ||
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|ItemName= Carbon free plasmas | |||
|ItemConfiguration= The process chamber does not have any carbon containing etch gasses. Therefore, polymer build-up on the chamber walls is not an issue. The 'carbon free' policy does not, however, apply to the choice of masking materials and CSAR, AZ and DUV resists are allowed. | |||
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