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Specific Process Knowledge/Lithography: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,528 edits
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!Typical exposure time
!Typical exposure time
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2s-30s pr. wafer using mask aligners.
2s-180s pr. wafer using mask aligners.


10min-5hours pr. wafer using maskless aligners.
10min-5hours pr. wafer using maskless aligners.
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