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LabAdviser/314/Preparation 314-307/Solid-matter: Difference between revisions

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[[File:IMG_3665.JPG|200px|left|thumb|Location Building 307, Prep Lab 109]]<br />
[[File:IMG_3665.JPG|200px|left|thumb|Location Building 307, Prep Lab 109]]<br />
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== Ultrasonic cutter ==
[http://www.labmet.cl/Documentos/Manuales/Manual%20-%20ULTRASONIC%20DISK%20CUTTER%20MODEL%20170.pdf Manual]
[[File:Ultrasonic_Cutter.jpg|200px|left|thumb|Location Building 307, Prep Lab 109]].<br />
 
 
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[[File:Labopol4.png|200px|left|thumb|Location Building 307, Prep Lab 109]]<br />
[[File:Labopol4.png|200px|left|thumb|Location Building 307, Prep Lab 109]]<br />
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== Dimple Grinder ==
[http://www.labmet.cl/Documentos/Manuales/Manual%20-%20DIMPLING%20GRINDER%20MODEL%20200.pdf Manual]
[[File:Dimple_Grinder.jpg|200px|left|thumb|Location Building 307, Prep Lab 109]].<br />
 
 
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== Dimple Grinder ==
[http://www.labmet.cl/Documentos/Manuales/Manual%20-%20DIMPLING%20GRINDER%20MODEL%20200.pdf Manual]
[[File:Dimple_Grinder.jpg|200px|left|thumb|Location Building 307, Prep Lab 109]].<br />
<br clear="all" />
== Ultrasonic cutter ==


[http://www.labmet.cl/Documentos/Manuales/Manual%20-%20ULTRASONIC%20DISK%20CUTTER%20MODEL%20170.pdf Manual]


[[File:Ultrasonic_Cutter.jpg|200px|left|thumb|Location Building 307, Prep Lab 109]].<br />
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= Missing equipment =
= Missing equipment =