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==Software for analysis==
==Software for analysis==
Please see the Data Analysis section at the main [[Specific Process Knowledge/Characterization/XRD|XRD page]].
Please see the Data Analysis section at the main [[Specific Process Knowledge/Characterization/XRD|XRD page]].
==Characterization of thin films using X-ray reflectivity (XRR)==
Implementing the XRR method the user can calculate thickness, density, and roughness of the deposited material. The XRR is also widely employed for multilayer stack analysis.
Here are some results available:
* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Aluminium/Al_Ebeam_evaporation_in_Temescal|e-beam deposited Al thin films]].
* Characterization of [[Specific_Process_Knowledge/Characterization/XRD/XRD_SmartLab/ALD_deposited_alumina_and_titania_XRR_and_SE_comparison|ALD deposited Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> ultrathin layers]].


==Equipment performance and process related parameters==
==Equipment performance and process related parameters==
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==Characterization of thin films using X-ray reflectivity (XRR)==
Implementing the XRR method the user can calculate thickness, density, and roughness of the deposited material. The XRR is also widely employed for multilayer stack analysis.
Here are some results available:
* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Aluminium/Al_Ebeam_evaporation_in_Temescal|e-beam deposited Al thin films]].
* Characterization of [[Specific_Process_Knowledge/Characterization/XRD/XRD_SmartLab/ALD_deposited_alumina_and_titania_XRR_and_SE_comparison|ALD deposited Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> ultrathin layers]].