Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
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* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Nanoscale silicon etching with SF6 and O2|Nanoscale silicon etching with SF6 and O2 ]] | * [[Specific Process Knowledge/Etch/DRIE-Pegasus/Nanoscale silicon etching with SF6 and O2|Nanoscale silicon etching with SF6 and O2 ]] | ||
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Si Nano Etching|Black silicon on Demand]] | * [[Specific Process Knowledge/Etch/DRIE-Pegasus/Si Nano Etching|Black silicon on Demand]] | ||
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Nanoscale silicon etching | * [[Specific Process Knowledge/Etch/DRIE-Pegasus/Nanoscale silicon etching|Nanoscale silicon etching with SF6 and O2 ]] | ||
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch high aspect ratio silicon microstructures|Etch high aspect ratio silicon microstructures ]] | * [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch high aspect ratio silicon microstructures|Etch high aspect ratio silicon microstructures ]] | ||
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch 3 dimensional silicon microstructures|Etch 3 dimensional silicon microstructures]] | * [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch 3 dimensional silicon microstructures|Etch 3 dimensional silicon microstructures]] | ||
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch black silicon|Etch black silicon]] | * [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch black silicon|Etch black silicon]] | ||
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Using OES to monitor etch process|Using OES to monitor etch process]] | * [[Specific Process Knowledge/Etch/DRIE-Pegasus/Using OES to monitor etch process|Using OES to monitor etch process]] | ||
Revision as of 11:29, 11 May 2020
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