Specific Process Knowledge/Thin film deposition: Difference between revisions
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[[/Lesker|MnIr]]<br/> | [[/Lesker|MnIr]]<br/> | ||
[[/Lesker|NiCo]]<br/> | [[/Lesker|NiCo]]<br/> | ||
[[/Deposition of NiFe|NiFe | [[/Deposition of NiFe|NiFe]]<br/> | ||
[[/Lesker|YSZ (Yttrium stabilized Zirconium)]]<br/> | [[/Lesker|YSZ (Yttrium stabilized Zirconium)]]<br/> | ||
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Revision as of 11:20, 26 March 2020
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Choose material to deposit
Dielectrica | Semicondutors | Metals | Alloys | Transparent conductive oxides | Polymers |
Silicon Nitride - and oxynitride |
Aluminium |
TiW alloy (10%/90% by weight) |
ITO (Tin doped Indium Oxide) |
SU-8 |
Choose deposition equipment
PVD | LPCVD | PECVD | ALD | Coaters | Others
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See the Lithography/Coaters page for coating polymers |
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