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==Pegasus 4 - 150mm silicon oxide and silicon nitride etching==
==Pegasus 4 - 150mm silicon oxide and silicon nitride etching==


'''The tool is currently being installed - we hope that it will be available in the second half of 2019. Some gasses needed for silicon oxide etching has not been installed yet
'''The tool is already installed and ready to process. The picoscope, the chamber are working well right now but we still have some troubles with the wafers aligner in the loadlock.
'''
'''


[[Image:Twinx.jpg |frame|left|x300px|The twin Pegasi (3 and 4) have just been rolled into the lab on July 3rd 2018. ]]
[[Image:Twinx.jpg |frame|left|x300px|The twin Pegasi (3 and 4) have just been rolled into the lab on July 3rd 2018. ]]




 
'''The user manual(s), quality control procedure(s) and results, user APV(s) are not available, technical information and contact information can be found in LabManager:'''
'''Feedback to this page:
[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus click here]'''
[[Category: Equipment |Etch DRIE]]
[[Category: Etch (Dry) Equipment|DRIE]]
 
= DRIE-Pegasus 1=
 
[[Image:DRIE-Pegasus.jpg |frame|left|x300px|The DRIE-Pegasus 1 load lock and cassette loader in the Nanolab cleanroom A-1]]
 
'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''


Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=265| LabManager]
Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=265| LabManager]
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'''[[Specific Process Knowledge/Etch/DRIE-Pegasus/StandardRecipes|Standard recipes]]'''
'''[[Specific Process Knowledge/Etch/DRIE-Pegasus 4/StandardRecipes|Standard recipes]]'''
 
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/processA|Process A (Large trench): 80 µm wide trench etched down to a depth of 150 µm]]


*[[Specific Process Knowledge/Etch/DRIE-Pegasus/processB|Process B (Via etch): 30 µm diameter via etched down to a depth of 100 µm]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus 4/SOIetch |SOI etch]]
 
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/processC|Process C (Nano etch): 50-300 nm posts]]
 
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/processD|Process D (Micro stamp) ''Please note that this process has changed'' ]]
 
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/SOIetch|SOI etch]]


'''Hardware changes'''
'''Hardware changes'''


A few hardware modifications have been made on the Pegasus since it was installed in 2010. The changes are listed below.
A few hardware modifications have been made on the Pegasus since it was installed in 2019. The changes are listed below.
 
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange|Change of showerhead in December 2014]]


*[[Specific Process Knowledge/Etch/DRIE-Pegasus/picoscope|Addition of Picoscope oscilloscope system for process monitoring in February 2017]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus 4/showerheadchange|Change of showerhead in 2019]]


*[[Specific Process Knowledge/Etch/DRIE-Pegasus/Claritas|Addition of a Claritas optical endpoint system in June 2018]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus 4/picoscope|Addition of Picoscope oscilloscope system for process monitoring in February 2019]]




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