Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions

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 ==Stress in deposited films==
-Sputter deposition causes stress in the deposited material. Depending on the sputter parameters, the stress can be either tensile or compressive. In 2017 Radu Malureanu investigated the stress in Si, Cr and Cu films deposited with the Lesker sputter system under a range of circumstances.
+Sputter deposition causes stress in the deposited material. Depending on the sputter parameters, the stress can be either tensile or compressive. In 2017 Radu Malureanu investigated the stress in NiFe, Si, Cr and Cu films deposited with the Lesker sputter system under a range of circumstances.
-Results of the study may be found here:
+Results of the study and links to further reading may be found here:
 *[[Specific Process Knowledge/Thin film deposition/Lesker/Stress dependence on sputter parameters in the Lesker sputter system|Stress dependence on sputter parameters]].
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