Specific Process Knowledge/Thin film deposition: Difference between revisions
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[[/Deposition of Aluminium Nitride| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/> | [[/Deposition of Aluminium Nitride| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/> | ||
[[/Lesker|Tantalum (Ta<sub>2</sub>O<sub>5</sub>, Tantalum pentoxide)]]<br/> | [[/Lesker|Tantalum (Ta<sub>2</sub>O<sub>5</sub>, Tantalum pentoxide)]]<br/> | ||
[[/Lesker| | [[/Lesker|Chromia (Cr<sub>2</sub>O<sub>3</sub>, Chromium Oxide)]]<br/> | ||
[[/Deposition of Hafnium Oxide|Hafnium Oxide]]<br/> | [[/Deposition of Hafnium Oxide|Hafnium Oxide]]<br/> | ||
[[/Deposition of Titanium Nitride|Titanium Nitride]] - ''ceramic'' <br/> | [[/Deposition of Titanium Nitride|Titanium Nitride]] - ''ceramic'' <br/> |
Revision as of 12:51, 24 March 2020
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Choose material to deposit
Dielectrica | Semicondutors | Metals | Alloys | Transparent conductive oxides | Polymers |
Silicon Nitride - and oxynitride |
Aluminium |
TiW alloy (10%/90% by weight) |
ITO (Tin doped Indium Oxide) |
SU-8 |
Choose deposition equipment
PVD | LPCVD | PECVD | ALD | Coaters | Others
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See the Lithography/Coaters page for coating polymers |
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