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Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions

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Eves (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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!colspan="1" border="none" style="background:silver; color:black;" align="center"|Recipe name  
!colspan="1" border="none" style="background:silver; color:black;" align="center"|Recipe name  
|style="background:silver; color:black"|'''Target material'''
|style="background:silver; color:black"|'''Target material'''
|style="background:silver; color:black"|<b>Pressure (mTorr)</b>
|style="background:silver; color:black"|'''Pressure (mTorr)'''
|style="background:silver; color:black"|<b>Power (W)</b>
|style="background:silver; color:black"|'''Power (W)'''
|style="background:silver; color:black"|<b>Deposition rate (nm/min)</b>
|style="background:silver; color:black"|'''Deposition rate (nm/min)'''
|style="background:silver; color:black"|<b>Uniformity (%)<br> on 6 inch wafer</b>
|style="background:silver; color:black"|'''Uniformity (%)<br> on 6 inch wafer'''
|style="background:silver; color:black"|<b>Comments</b>
|style="background:silver; color:black"|'''Comments'''




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