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Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions

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==Distribution chamber (Genmark robot)==
==Distribution Chamber (Genmark robot)==


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<gallery caption="Deposition rates of HfO2 at different temperaturs. ALD window." widths="600px" heights="600px" perrow="2">
image:arm_robot_distribution_chamber.jpg| Deposition rate of HfO<sub>2</sub> at 150 <sup>o</sup>C. Substrate: Silicon 6" wafer with native oxide.
</gallery>


==Load lock==
==Load lock==
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