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Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions

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Eves (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,346 edits
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=Tool architecture=
= sputtering deposition system design=
 
==Power suppliy configuration==
 
bla bla


== Sputter-System Metal-Oxide(PC1) ==
== Sputter-System Metal-Oxide(PC1) ==
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Lift-off of magnetic materials should never be done in the normal lift-off bath in RR4. It should always be done in the dedicated lift-off bath in the fumehood next to the sputter.
Lift-off of magnetic materials should never be done in the normal lift-off bath in RR4. It should always be done in the dedicated lift-off bath in the fumehood next to the sputter.
==Distribution chamber (Genmark robot)
bla bla
==Load lock==
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