Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions

@@ Line 306: / Line 306: @@
 |}
-==Stress analysis - section under construction [[Image:section under construction.jpg|70px]]==
+==Stress in deposited films - section under construction [[Image:section under construction.jpg|70px]]==
-Sputter deposition causes stress in the deposited thin film. Depending on the sputter parameters, the stress can be either tensile or compressive. Radu has investigated the stress in films deposited with the Lesker under a range of circumstances.
+Sputter deposition causes stress in the deposited material. Depending on the sputter parameters, the stress can be either tensile or compressive. In 2017 Radu Malureanu investigated the stress in Si, Cr and Cu films deposited with the Lesker sputter system under a range of circumstances.
+Results of the study may be found here:
+*[[Specific Process Knowledge/Thin film deposition/Lesker/Stress dependence on sputter parameters in the Lesker sputter system|Stress under different sputter parameters]].
 ==List of available targets for the Sputter-System(Lesker) (03 June 2013)==