Specific Process Knowledge/Thin film deposition

3rd Level - Material/Method

Feedback to this page: click here

Choose material to deposit

Dielectrica	Semicondutors	Metals	Alloys	Transparent conductive oxides	Polymers
Silicon Nitride - and oxynitride Silicon Oxide Titania (TiO2, Titanium Oxide) Alumina (Al2O3, Aluminium Oxide) Aluminum Nitride (AlxNy) Tantalum (Ta2O5, Tantalum pentoxide) Cromia (Cr2O3, Chromium Oxide) Hafnium Oxide Titanium Nitride - ceramic	Silicon Germanium Zinc Oxide (ZnO)	Aluminium Chromium Cobalt Copper Gold Iron Magnesium Molybdenum Nickel Niobium Palladium Platinum Ruthenium Silver Tantalum Tin Titanium Tungsten Zinc	TiW alloy (10%/90% by weight) NiV alloy AlCu CoFe CuTi FeMn MnIr NiCo NiFe YSZ (Yttrium stabilized Zirconium)	ITO (Tin doped Indium Oxide) AZO (Aluminum doped Zinc Oxide)	SU-8 Antistiction coating Topas PMMA

Choose deposition equipment

PVD	LPCVD	PECVD	ALD	Coaters	Others
Lesker - Sputter tool Wordentec - E-beam evaporator, sputter and thermal evaporator Thermal evaporator E Beam Evaporator (Temescal) Physimeca - E-beam evaporator IBE/IBSD Ionfab 300 - Sputter deposition of high quality optical layers and milling/etching Sputter coater 03 - Gold sputtering system Sputter coater 04 - Gold sputtering system	Furnace LPCVD Nitride (4" and 6") - Deposition of silicon nitride Furnace LPCVD Polysilicon (4" and 6") Deposition of polysilicon Furnace LPCVD TEOS (4") - Deposition of silicon oxide	PECVD - Plasma Enhanced Chemical Vapor deposition Black Magic PECVD - Black Magic PECVD (Carbon) Seki Diamond CVD - Microwave Plasma CVD for diamond Growth	ALD1 - Atomic Layer Deposition (thermal) ALD2 (PEALD) - Atomic Layer Deposition (thermal and plasma enhanced)	See the Lithography/Coaters page for coating polymers	MVD - Molecular Vapor Deposition Electroplating-Ni - Electrochemical deposition of nickel Electroplating-Cu - Electrochemical deposition of copper MOCVD - Epitaxial growth - Ask the department of photonics if you are interested: Elizaveta Semenova or Kresten Yvind