Specific Process Knowledge/Thin film deposition/Wordentec: Difference between revisions

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 The Wordentec is a machine for:
-*Deposition of metal through E-beam deposition
+*Deposition of metals by e-beam evaporation
-*Deposition of metal through thermal evaporation
+*Deposition of metals by thermal evaporation
-*Deposition of materials through DC sputtering
+*Deposition of materials by DC sputtering
-*Cleaning of samples before deposition through Argon RF sputter clean
+*Cleaning samples before deposition by Argon RF sputter cleaning
-The Wordentec is designed to deposit on 1-6 samples in sequence, samples of a size up to 6" in diameter.
-Adaptors exist for deposition on 2", 4" and 6" wafers, but deposition is possible on samples of almost any size and shape, as long as they do not exceed the size of a 6" substrate.
+The Wordentec is designed to deposit on 1-6 samples in sequence.
-The Wordentec supports either single sample deposition on each sample or batch deposition on six wafers in sequence. It is possible to freely combine processes from the machines different sources.
+Adaptors exist for deposition on 2", 4" and 6" wafers and deposition is possible on samples of almost any size and shape, as long as they do not exceed a 6" diameter.
+The Wordentec supports either single sample deposition for running a separate recipe on each sample or batch deposition for six wafers in sequence. It is possible to freely combine processes from the machine's different sources.