Specific Process Knowledge/Thin film deposition/Sputter coater: Difference between revisions

Revision as of 18:07, 3 March 2020 view source Eves (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 4,346 edits →Process knowledge ← Older edit		Revision as of 18:08, 3 March 2020 view source Eves (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 4,346 edits →The Sputter coater 04 (Agar Scientific) Newer edit →
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	Argon is used as a sputter gas to generate a plasma in the sputter chamber and to vent the chamber.		Argon is used as a sputter gas to generate a plasma in the sputter chamber and to vent the chamber.

	The Sputter coater 04 (Agar Scientific) is located in the cleanroom Cx1.		The Sputter coater 04 (Agar Scientific) is located in the cleanroom Cx1